印制电子用阻焊油墨及其发展趋势

doi:10.7517/j.issn.1674-0475.2014.04.314

影像科学与光化学 ›› 2014, Vol. 32 ›› Issue (4): 314-320.DOI: 10.7517/j.issn.1674-0475.2014.04.314

印制电子用阻焊油墨及其发展趋势

杨超, 常煜, 杨振国

复旦大学材料科学系, 上海 200433

收稿日期:2014-03-30 修回日期:2014-05-15 出版日期:2014-07-15 发布日期:2014-07-15
通讯作者: 杨振国

Solder Resist Ink for Printed Electronics and Its Developmental Tendency

YANG Chao, CHANG Yu, YANG Zhenguo

Department of Material Science, Fudan University, Shanghai 200433, P.R. China

Received:2014-03-30 Revised:2014-05-15 Online:2014-07-15 Published:2014-07-15

摘要/Abstract

摘要：

本文介绍了PCB制造过程中所用阻焊油墨的研究现状及其发展趋势，重点介绍了可喷墨打印阻焊油墨、柔性电路板用阻焊油墨、水溶性碱显影感光阻焊油墨和LED封装用白色阻焊油墨的研究现状及趋势。

关键词: 阻焊油墨, 超支化树脂, 喷墨打印, 感光显影

Abstract:

Recent studies on solder resist ink for PCB manufacture and its developmental trendwere introducedand reviewed, focusing on solder resist ink for inkjet printing, solder resist for flexible electronics, water soluble photoimageable solder resist ink and white solder resist for LED package.

Key words: solder resist ink, hyperbranched resin, inkjet printing, photoimageable

杨超, 常煜, 杨振国. 印制电子用阻焊油墨及其发展趋势[J]. 影像科学与光化学, 2014, 32(4): 314-320.

YANG Chao, CHANG Yu, YANG Zhenguo. Solder Resist Ink for Printed Electronics and Its Developmental Tendency[J]. Imaging Science and Photochemistry, 2014, 32(4): 314-320.

参考文献

[1] 林其水.电路板印刷中阻焊油墨的选用和常见故障的处理[J].印制电路信息, 2009,(12): 46-51. Lin Q S. Selection of solder resist for printed circuit board printing and troubleshooting of common faults[J]. Printed Circuit Information, 2009, (12): 46-51.
[2] Yue W, Li C W, Xu T, Yang M. Screen printing of solder resist as master substrates for fabrication of multi-level microfluidic channels and flask-shaped microstructures for cell-based applications[J]. Biosensors and Bioelectronics, 2013,41:675-683.
[3] Ferguson T, Qu J. Effect of moisture on the interfacial adhesion of the underfill/solder mask interface[J]. Journal of Electronic Packaging, 2002, 124(2):106-110.
[4] Zhu H, Guo Y, Li W Y, Tseng A A, Martin B. Micro-mechanical characterizations of solder mask materials.[C] In: Electronics Packaging Technology Conference, 2000. IEEE: Proceedings of 3rd:148-153.
[5] Siau S, Vervaet A, Degrande S, Schacht E, Calster A V. Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes[J]. Applied Surface Science, 2005, 245(1):353-368.
[6] 杨振国.一种面向PCB的全印制电子技术[J]. 印制电路信息,2008, 9: 9-12. Yang Z G. A kind of PCB oriented fully printed electronics technology[J]. Printed Circuit Information, 2008,9: 9-12.
[7] Cheng K, Yang M H, Chiu W W, Huang C Y, Chang J,Ying T F,Yang Y. Ink-jet printing, self-assembled polyelectrolytes, and electroless plating: low cost fabrication of circuits on a flexible substrate at room temperature[J]. Macromolecular Rapid Communications, 2005, 26(4):247-264.
[8] Bidoki S M, Lewis D M, Clark M, Vakorov A, Millner P A, MCGORMAN D. Ink-jet fabrication of electronic components[J]. Journal of Micromechanics and Microenginee-ring, 2007,17(5):967.
[9] Scott J G. Digital printing for printed circuit boards[J]. Circuit World, 2005, 31(4):34-41.
[10] James M. Manufacturing printed circuit boards using ink jet technology.[C] In: NIP & Digital Fabrication Confe-rence, Society for Imaging Science and Technology, 2003(2):651-655.
[11] Yang C, Yang Z G. Synthesis of low viscosity, fast UV curing solder resist based on epoxy fesin for ink-jet printing[J]. Journal of Applied Polymer Science, 2013, 129(1): 187-192.
[12] 杨超, 杨振国. 喷墨打印用超支化聚酯阻焊剂的制备与表征[J].印制电路信息, 2013, 12:18-21. Yang C, Yang Z G. Preparation and characterization of hyperbranched polyester-based solder resist for inkjet printing[J]. Printed Circuit Information, 2013, 12:18-21.
[13] Jeng J L, King J S, Liu S F, Tsai J Y. Thermally curable solder resist composition.[P] US patent 8420745. 2013-04-16.
[14] Jeong W J, Choi B J, Choi B Y, Lee K J, Jeong M S. Photo-curable and thermo-curable resin composition, and a dry film solder resist.[P] US patent, 8349538, 2011-07-22.
[15] 李世荣.水显影阻焊剂用光敏树脂的合成及性能研究. 湖北:华中科技大学材料系, 2007. Li S R. Study of synthesis and properties of water-soluble polymeric resins used for solder mask .[D] Hubei:Huazhong University of Science and Technology, Material Science, 2007.
[16] 应明友,胡建琪,张胜文,刘仁,江金强,刘晓亚.光敏性氨基丙烯酸树脂的合成及其在光成像阻焊油墨中的应用研究[J].信息记录材料, 2008,9(5): 10-15. Ying M Y, Hu J Q, Zhang S W, Liu R, Jiang J Q, Liu X Y. Preparation of UV curable amino-acrylate resin and its application in photoimageable solder resist ink[J]. Information Recording Materials, 2008,9(5): 10-15.
[17] 应明友,胡建琪,虞学俊,张胜文,刘晓亚, 等. 光敏氨基丙烯酸酯树脂的合成及其油墨应用[J]. 热固性树脂, 2008,23(5): 18-23. Ying M Y, Hu J Q, Yu X J, Zhang S W, LIU X Y. Synthesis of UV curable amino-acrylate resin and its application in ink[J]. Thermosetting Resin, 2008,23(5): 18-23.
[18] Sun F, Liao B, Zhang L, Du H G, Huang Y D. Synthesis and characterization of alkali-soluble photosensitive polysiloxane urethane acrylate[J]. Journal of Applied Polymer Science, 2011, 120(6): 3604-3612.
[19] Sun F, Liu X, Zhang L, Du H G. Synthesis and characterization of alkali-soluble hyperbranched photosensitive polysiloxane urethane acrylate[J]. Industrial & Engineering Chemistry Research, 2011, 51(1): 240-247.
[20] Li G, Jiang S, Gao Y, Liu X, Sun F. Synthesis and property of water-soluble hyperbranched photosensitive polysiloxane urethane acrylate[J]. Industrial & Engineering Chemistry Research, 2013,52(6): 2220-2227.
[21] Starkey P. ICT Darlington seminar 2011[C]. Circuit World, 2012,38(2):1-2.
[22] Peels W, Cheng K, Hu J, Jiao J, Jin D, Rebergen H, Sun P, Van Wijk R. Assessment of low cost, sustainable, reflective layers for optical mixing[J]. Key Engineering Materials, 2014, 572:62-65.
[23] Cho H S.Light emitting device package[P]. US patent application,13/868,812. 2013-04-23.

印制电子用阻焊油墨及其发展趋势

Solder Resist Ink for Printed Electronics and Its Developmental Tendency

PDF (PC)

可视化

摘要/Abstract

引用本文

使用本文

参考文献

相关文章 7

编辑推荐

Metrics

本文评价

[1]	田培娟, 余节约, 丁建浩. 基于像素聚集形态的喷墨打印面积计算方法[J]. 影像科学与光化学, 2020, 38(5): 795-800.
[2]	王浩东, 孙冠卿, 安丰磊, 袁燕华, 刘仁. 叔碳酸缩水甘油酯改性碱溶性酚醛环氧丙烯酸酯的研究[J]. 影像科学与光化学, 2019, 37(3): 185-194.
[3]	许阳阳, 李治全, 安丰磊, 袁燕华, 刘仁. 腰果酚缩水甘油醚改性碱溶性酚醛环氧丙烯酸酯的制备及应用[J]. 影像科学与光化学, 2018, 36(6): 522-531.
[4]	刘停停, 朱天翔, 邵琳, 赵新洛, 赵建文, 崔铮. 喷墨打印构建碳纳米管薄膜晶体管及其电性能的研究[J]. 影像科学与光化学, 2018, 36(3): 245-253.
[5]	罗妍, 周奕华, 钱俊. 基于喷墨打印石墨烯透明导电薄膜研究进展[J]. 影像科学与光化学, 2016, 34(5): 482-490.
[6]	赵文秀, 周奕华, 钱俊. 基于印刷电子的透明导电薄膜研究进展[J]. 影像科学与光化学, 2015, 33(3): 251-263.
[7]	王艳梅, 魏杰. 超支化树脂改性UV固化粉末涂料[J]. 影像科学与光化学, 2003, 21(2): 126-131.