影像科学与光化学 ›› 2017, Vol. 35 ›› Issue (2): 99-105.DOI: 10.7517/j.issn.1674-0475.2017.02.099

• 论文 • 上一篇    下一篇

无透镜数字全息显微成像技术与应用

盛海见1,2, 吴育民1,2, 文永富1,2, 李根1,2, 程灏波1,2   

  1. 1. 北京理工大学 光电学院 光机电联合研究中心, 北京 100081;
    2. 北京理工大学 深圳研究院, 广东 深圳 518057
  • 收稿日期:2017-01-20 修回日期:2017-02-16 出版日期:2017-03-15 发布日期:2017-03-15
  • 通讯作者: 文永富
  • 基金资助:

    教育部重点实验室2016开放基金(2016OEIOF05)和深圳市科技创新项目资助

The Technology of Lensless Digital Holographic Microscopy and Its Application

SHENG Haijian1,2, WU Yumin1,2, WEN Yongfu1,2, LI Gen1,2, CHENG Haobo1,2   

  1. 1. Joint Research Center for Optomechatronics Engineering, School of Optoelectronics, Beijing Institute of Technology, Beijing 100081, P. R. China;
    2. Shenzhen Research Institute, Beijing Institute of Technology, Shenzhen 518057, Guangdong, P. R. China
  • Received:2017-01-20 Revised:2017-02-16 Online:2017-03-15 Published:2017-03-15

摘要:

针对微结构和微光学元件等微小物体的表面定量检测,本文介绍了一种利用无透镜数字全息的快速、无损的显微成像方法。首先介绍了基于球面波的无透镜数字全息显微成像技术的基本原理,采用CCD作为光电转换器件,基于迈克尔逊干涉光路,设计了无透镜数字全息显微成像系统,利用反射镜构成折反式光路,系统结构简单、紧凑,提升了系统便携性。然后利用USAF1951分辨率板对构建的成像系统进行了标定实验,得出其横向分辨率为6.69 μm,放大倍率为3.375,系统工作距离为12.0 mm。此外,还对晶圆表面结构进行实际测量。实验验证了该系统的可行性和有效性,有望进一步应用于MEMS、微光学元件、光学元件等表面形貌的定量测量中。

关键词: 无透镜数字全息, 显微成像, 光学表面检测, MEMS

Abstract:

Aiming at the observation of micro structures and micro optical elements, we proposed a fast and nondestructive microscopic observation method based on lensless digital holography technology. Firstly, the basic principle of lensless digital holographic microscopy imaging technology based on spherical wave is introduced. CCD was adapted as photoelectric converter, designed the lensless digital holographic microscopy imaging system based on Michelson interference optical path,and the reflection mirrors were used to form a folded back optical path, which made the system structure simple,compact, and have a better portability. And we used USAF1951 resolution plate performed resolution calibration experiment and got that the resolution of the system was 6.69 μm,amplified factor was 3.375, and working distances was 12 mm. A practical measurement of the surface structure of wafer was also carried out. Experiments verified the feasibility and effectiveness of the system, and the method is expected to be applied to perform quantitative measurement for the surface topography of MEMS, micro optical elements and so on.

Key words: lensless digital holography, microscopy imaging, optical surfaces detection, MEMS