Imaging Science and Photochemistry ›› 2019, Vol. 37 ›› Issue (1): 33-45.DOI: 10.7517/issn.1674-0475.180902

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Preparation of Conductive Circuits Based on the Volume Additive in-situ

WU Qian1, ZHU Xiaoqun1, NIE Jun2   

  1. 1. Collage of Material Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, P. R. China;
    2. Faculty of Scinece, Beijing University of Chemical Technology, Beijing 100029, P. R. China
  • Received:2018-09-10 Revised:2018-12-03 Online:2019-01-15 Published:2019-01-15

Abstract: This research provide a method for preparing conductive circuits. Nano copper powders were used as conductive filler and photo-curable resin were used as linking agent to prepare copper-containing photo-curing ink. The copper nano particles were patterned by screen printing method. Then, the copper nano particle patterns were converted to silver pattern by in-situ volume addition. The results showed that the printed copper patterns were not conductive, the silver patterns generated by the in-situ replacement reaction were conductive. The copper content, silver salt concentration, irradiation times, reaction times had a relationship with the conductive ability. In this experiment, We have got circuits whose conductivity is 1.25×105 S/m.The conductive circuits have good bending character, good fatigue performance and repairable performance at the same time. This research provide a simple and cheep method for preparation of conductive circuits in room temperature.

Key words: conductive circuits, UV cured ink, volume additive in-situ, screen printing