Imaging Science and Photochemistry ›› 2020, Vol. 38 ›› Issue (3): 392-408.DOI: 10.7517/issn.1674-0475.191011

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Research Progress of Chemically Amplified Photoresist Materials

ZHENG Xiangfei1, SUN Xiaoxia1, LIU Jingcheng1, MU Qidao2, LIU Ren1, LIU Xiaoya1   

  1. 1. School of Chemical and Material Engineering, Jiangnan University, Wuxi 214122, Jiangsu, P. R. China;
    2. Suzhou Rui Hong Electronic Chemicals Co. Ltd., Suzhou 215124, Jiangsu, P. R. China
  • Received:2019-10-24 Online:2020-05-15 Published:2020-05-15

Abstract: The drive toward higher integration degree of chips has led to the development of new resist materials with high resolution. The lithography technology is also developed from ultraviolet full-spectrum to single short-wavelength based on the radiation source. In order to meet the requirements of high sensitivity and resolution of photoresist, chemically amplified photoresists have been developed. "Chemical amplified" can increase the quantum yields and enhance the sensitivity of photoresist, which has been widely used in deep ultraviolet and extreme ultraviolet photoresists. As the film forming agent of photoresist, the resin has a significant effect on the performance of photoresist. This paper focuses on several types of reactions in chemically amplified photoresists:deprotection, rearrangement, intramolecular dehydration, esterification polycondensation, crosslinking and depolymerization reaction. In addition, a series of polymers based on chemically amplified are highlighted, since different resin structures correspond to different reaction mechanisms.

Key words: chemical amplified, photoresist, sensitivity, film-forming resin, reaction mechanism