Imaging Science and Photochemistry ›› 2006, Vol. 24 ›› Issue (2): 87-92.DOI: 10.7517/j.issn.1674-0475.2006.02.87

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Preparation of Polycrystalline Silicon Films by Aluminum-Induced Crystallization at Low Temperature

XIA Dong-lin, YANG Sheng, XU Man, ZHAO Xiu-jian   

  1. Key Laboratory of Silicate Materials Science and Engineering of Ministry of Education, Wuhan University of Technology, Wuhan 430074, Hubei, P. R. China
  • Received:2005-09-16 Revised:2005-12-05 Online:2006-03-23 Published:2006-03-23

Abstract: Polycrystalline silicon films were fabricated by aluminum-induced crystallization.These films are prepared by plasma-enhanced chemical vapor deposition technology from hydrogen-diluted SiH4 and B2H6.The effect of thickness of aluminum films on the microstructure and morphology were investigated.The results were analyzed by XRD,RAMAN and SEM.The thickness of aluminum film was found to play a critical role in the extent of crystallization of a-Si thin film.The experiment indicate that a-Si thin films with thickness of aluminum films for sputtering time 10 s were amorphous structure after annealing 450 ℃ for 20 min,a-Si films with thickness of aluminum film for sputtering time 20 s began to crystallize after annealing at 450 ℃ for 20 min,and the crystallinity of a-Si thin films was enhanced obviously with increment of thickness of aluminum films.

Key words: aluminum-induced crystallization, rapid thermal annealing, polycrystalline silicon thin films, amorphous silicon thin films

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