STUDIES ON A KIND OF NEGATIVE PHOTORESIST BASED ON PHOTOSENSITIVE POLYIMIDES

doi:10.7517/j.issn.1674-0475.1999.04.334

Imaging Science and Photochemistry ›› 1999, Vol. 17 ›› Issue (4): 334-337.DOI: 10.7517/j.issn.1674-0475.1999.04.334

Previous Articles Next Articles

STUDIES ON A KIND OF NEGATIVE PHOTORESIST BASED ON PHOTOSENSITIVE POLYIMIDES

LI Jiashen¹, LI Zuobang¹, ZHU Pukun¹, YANG Lifang¹, LI Fang¹, JIAO Xiaoming², CHENG Aiping², CHEN Jianjun ²

1. Hebei University of Technology, Tianjin 300130, P. R. China;
2. The Institute of Chemical Reagent, Beijing 100022, P. R. China

Received:1998-10-27 Revised:1999-02-09 Online:1999-11-20 Published:1999-11-20

Abstract

Abstract: A kind of negative photoresist, composed of photosensitive polyimides and N-methyl-2-pyrrolidone was formulated. The curing mechanism and the relationship of the properties and structure of PSPIs were studied. The results of TGA show that the PSPIs have excellent heat-resistance. Based on our research, the pattern with line-width as low as 2.5 μm was gained with the conventional UV photolithography under the optimum parameters.

Key words: photosensitive polyimide, curing mechanism, thermogravimtric analysis, photolithographic process

LI Jiashen, LI Zuobang, ZHU Pukun, YANG Lifang, LI Fang, JIAO Xiaoming, CHENG Aiping, CHEN Jianjun . STUDIES ON A KIND OF NEGATIVE PHOTORESIST BASED ON PHOTOSENSITIVE POLYIMIDES[J]. Imaging Science and Photochemistry, 1999, 17(4): 334-337.

STUDIES ON A KIND OF NEGATIVE PHOTORESIST BASED ON PHOTOSENSITIVE POLYIMIDES

PDF (PC)

Knowledge

Abstract

Cite this article

share this article

References

Related Articles 0

Recommended Articles

Metrics

Comments