A Novel UV Photoresist Matrix Resin and Its Photolithographic Processes

doi:10.7517/j.issn.1674-0475.2010.01.52

Abstract

Abstract: The poly(N-(p-carboxylphenyl)methacrylamide-co-N-phenylmaleimide) was copolymerized with monomer N-(p-carboxylphenyl)methacrylamide(NCMA) and N-phenylmaleimide(NPMI). To apply this copolymer as the matrix resin with photosensitizer and solvents to fomulate a novel thermostable UV positive photoresist.The photoresist formulation and the photolithographic process were studied and optimized.Its optimal formulation was 15%—20%matrix resin, 4.5%—6%photo-sensitizer,and 70%—80%solvent,and its photolithographic process was spincoating 30 s(4000 rpm),pre-baking 4 min at 90℃,exposuring 3 min,developing in 0.2% TMAH aqueous solution for 10 s and then post-baking 2 min at 90℃.

Key words: UV positive photoresist, photolithography

CLC Number:

XIE Wen, LIU Jian-guo, LI Ping. A Novel UV Photoresist Matrix Resin and Its Photolithographic Processes[J]. Imaging Science and Photochemistry, 2010, 28(1): 52-58.

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