光子烧结技术在印刷电子技术中的应用研究进展

doi:10.7517/j.issn.1674-0475.2014.04.303

摘要/Abstract

摘要：

光子烧结技术是一种低温、选择性、非接触式烧结技术，可以对衬底上的各种纳米材料墨水进行固化烧结，实现墨水的功能化，并获得印刷电子器件的物理性能。光子烧结技术包括激光烧结、红外烧结及闪灯烧结，它们又具有各自的应用特点，在印刷电子领域中受到了广泛的关注。本文简要介绍了光子烧结技术的一些相关研究，重点介绍了光子烧结技术在金属纳米导电墨水中的应用及研究进展。

关键词: 光子烧结, 印刷电子, 激光, 红外, 闪灯

Abstract:

Photonic sintering is a kind of low-temperature, selective and non-contact sintering technology, which can sinter nano material ink on the transparent film substrate, realize the function of ink material, and finally obtain the physical properties of printed electronic devices. Photonic sintering technology includeslaser sintering, infrared sintering and pulsed light sintering. They also have their application features, which have been widely concerned in the field of printed electronics. This paper briefly introduces some research progress and application of photonic sintering technology, mainly focusing on the metallic nano conductive inks.

Key words: photonic sintering, printable electronics, laser, infrared, pulsed light

顾唯兵, 林剑, 陈征, 崔铮. 光子烧结技术在印刷电子技术中的应用研究进展[J]. 影像科学与光化学, 2014, 32(4): 303-313.

GU Weibing, LIN Jian, CHEN Zheng, CUI Zheng. Research Progress of Photonic Sintering Technology in Printable Electronics[J]. Imaging Science and Photochemistry, 2014, 32(4): 303-313.

参考文献

[1] 崔铮,邱松,陈征,林剑,赵建文,马昌期,苏文明.印刷电子学——材料、技术及其应用[M]. 北京:高等教育出版社,2012. 16-19. Cui Z, Qiu S, Chen Z, Lin J, Zhao J W, Ma C Q, Su W M. Printed Electronics: Materials,Technologies and Applications[M]. Beijing: Higher Education Press, 2012. 16-19.
[2] Kim C, Nogi M, Suganuma K. Electrical conductivity enhancement in inkjet-printed narrow lines through gradual heating[J]. Journal of Micromechanics and Microenginee-ring, 2012, 22(3):5.
[3] Jeong S, Song H C, Lee W W, Choi Y, Ryu B H. Preparation of aqueous Ag Ink with long-term dispersion stability and its inkjet printing for fabricating conductive tracks on a polyimide film[J]. Journal of Applied Physics, 2010, 108(10):5.
[4] Allen M, Alastalo A, Suhonen M, Mattila T, Leppaniemi J, Seppa H. Contactless electrical sintering of silver nano-particles on flexible substrates[J]. IEEE Transactions on Microwave Theory and Techniques, 2011, 59(5):1419-1429.
[5] Perelaer J, Jani R, Grouchko M, Kamyshny A, Magdassi S, Schubert U S. Plasma and microwave flash sintering of a tailored silver nanoparticle ink, yielding 60% bulk conductivity on cost-effective polymer foils[J]. Advanced Mate-rials, 2012, 24(29):3993-3998.
[6] Reinhold I, Hendriks C E, Eckardt R, Kranenburg J M, Perelaer J, Baumann R R, Schubert U S. Argon plasma sintering of inkjet printed silver tracks on polymer substrates[J]. Journal of Materials Chemistry, 2009, 19(21):3384-3388.
[7] Buffat P, Borel J P. Size effect on melting temperature of gold particles[J]. Physical Review A, 1976, 13(6):2287-2298.
[8] Shyjumon I, Gopinadhan M, Ivanova O, Quaasz M, Wulff H, Helm C A, Hippler R. Structural deformation, melting point and lattice parameter studies of size selected silver clusters[J]. European Physical Journal D, 2006, 37(3):409-415.
[9] Bohren C F, Huffman D R. Absorption and Scattering of Light by Small Particles[M]. New York: Wiley. 1983.
[10] Lesyuk R, Jillek W, Bobitski Y, Kotlyarchuk B. Low-energy pulsed laser treatment of silver nanoparticles for interconnects fabrication by ink-jet method[J]. Microelectronic Engineering, 2011, 88(3): 318-321.
[11] Bieri N R, Chung J, Haferl S E, Poulikakos D, Grigoropoulos C P. Microstructuring by printing and laser curing of nanoparticle solutions[J]. Applied Physics Letters, 2003, 82(20):3529-3531.
[12] Chung J W, Ko S W, Bier N R, Grigoropoulos C P, Poulikakos D. Conductor microstructures by laser curing of printed gold nanoparticle ink[J]. Applied Physics Letters, 2004, 84(5):801-803.
[13] Dockendorf C P R, Choi T Y, Poulikakos D. Multilayer direct-writing of electrical conductors with gold nanoinks using the fountain-pen principle.[C] ASME/Pacific Rim Technical Conference on Integration and Packaging of MEMS, NEMS, and Electronic, 2005: 1959-1961.
[14] Ko S H, Chung J, Choi Y, Fabrication of inkjet printed flexible electronics by low temperature subtractive laser processing.[C] ASME International Mechanical Enginee-ring Congress and Exposition, 2005:599-603.
[15] Son Y, Yeo J, Ha C W, Lee J, Hong S, Nam K H, Yang D Y, Ko S H. Application of the specific thermal properties of Ag nanoparticles to high-resolution metal patterning[J]. Thermochimica Acta, 2012, 542: 52-56.
[16] Kumpulainen T, Pekkanen J, Valkama J, Laakso J, Tuokko R, Mantysalo M. Low temperature nanoparticle sintering with continuous wave and pulse lasers[J]. Optics and Laser Technology, 2010, 43(3): 570-576.
[17] Chiolerio A, Maccioni G, Martino P, Cotto M, Pandolfi P, Rivolo P, Ferrero S, Scaltrito L. Inkjet printing and low power laser annealing of silver nanoparticle traces for the realization of low resistivity lines for flexible electronics[J]. Microelectronic Engineering, 2010, 88(8):2481-2483.
[18] Gu W B, Lin J, Cui Z. Low-temperature laser sintering of printed nano-silver electrodes for flexible electronics.[C] Technical Proceedings of the 2012 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech, 2012:279-282.
[19] Lee D G, Kim D K, Moon Y J, Moon S J. Effect of laser-induced temperature field on the characteristics of laser-sintered silver nanoparticle ink[J]. Nanotechnology, 2013, 24(26): 9.
[20] Kang B, Kno J, Yang M. High-resolution and high-conductive electrode fabrication on a low thermal resistance flexible substrate[J]. Journal of Micromechanics and Microengineering, 2011, 21(7): 7.
[21] Peng P, Hu A, Zhou Y. Laser sintering of silver nanoparticle thin films: microstructure and optical properties[J]. Applied Physics a-Materials Science & Processing, 2012, 108(3): 685-691.
[22] Ko S H,Pan H,Grigoropoulos C P,Luscombe C K,Frechet J M J,Poulikakos D. All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles[J]. Nanotechnology, 2007, 18(34): 8.
[23] Ko S H, Chung J, Pan H, Grigoropoulos C P, Poulikakos D. Fabrication of multilayer passive and active electric components on polymer using inkjet printing and low temperature laser processing[J]. Sensors and Actuators A-Physical, 2007, 134(1): 161-168.
[24] Hu M, Hartland G V. Heat dissipation for Au particles in aqueous solution: relaxation time versus size[J]. Journal of Physical Chemistry B, 2002, 106(28):7029-7033.
[25] Son Y, Yeo J, Ha C W, Lee J, Hong S, Nam K H, Yang D Y, Ko S H. Application of the specific thermal properties of Ag nanoparticles to high-resolution metal patterning[J]. Thermochimica Acta, 2012, 542: 52-56.
[26] Son Y, Yeo J, Moon H, Lim T W, Hong S, Nam K H, Yoo S, Grigoropoulos C P, Yang D Y, Ko S H. Nanoscale electronics: digital fabrication by direct femtosecond laser processing of metal nanoparticles[J]. Advanced Materials, 2011, 23(28): 3176-3181.
[27] Tobjork D, Aarnio H, Pulkkinen P, Bollstrom R, Maattanen A, Ihalainen P, Makela T, Peltonen J, Toivakka M, Tenhu H, Osterbacka R. IR-sintering of ink-jet printed metal-nanoparticles on paper[J]. Thin Solid Films, 2012, 520(7): 2949-2955.
[28] Cherrington M, Claypole T C, Deganello D, Mabbett I, Watson T, Worsley D. Ultrafast near-infrared sintering of a slot-die coated nano-silver conducting ink[J]. Journal of Materials Chemistry, 2011, 21(21):7562-7564.
[29] Knischka R, Lehmann U, Stadler U, Mamak M, Benkhoff J. Novel approaches in NIR curing technology[J]. Progress in Organic Coatings, 2009, 64(23): 171-174.
[30] Watson T, Mabbett I, Wang H X, Peter L, Worsley D. Ultrafast near infrared sintering of TiO₂ layers on metal substrates for dye-sensitized solar cells[J]. Progress in Photovoltaics, 2011, 19(4): 482-486.
[31] Kim H S, Dhage S R, Shim D E, Hahn H T. Intense pulsed light sintering of copper nanoink for printed electronics[J]. Applied Physics A-Materials Science & Processing, 2009, 97(4): 791-798.
[32] Kang J S, Ryu J, Kim H S, Hahn H T. Sintering of inkjet-printed silver nanoparticles at room temperature using intense pulsed light[J]. Journal of Electronic Materials, 2011, 40(11): 2268-2277.
[33] Lee D J, Park S H, Jang S, Kim H S, Oh J H, Song Y W. Pulsed light sintering characteristics of inkjet-printed nanosilver films on a polymer substrate[J]. Journal of Micromechanics and Microengineering, 2011, 21(12): 7.
[34] Chung Wan-Ho, Hwang Hyun-Jun, Lee Seung-Hyun, Kim Hak-Sung. In-situ monitoring of a flash light sintering process for silver nano-ink for flexible electronics[J]. Nanotechnology, 2013, 24(3): 035202.
[35] Wang B Y, Yoo T H, Song Y W, Lim D S, Oh Y J. Cu ion ink for a flexible substrate and highly conductive patterning by intensive pulsed light sintering[J]. ACS Applied Materials & Interfaces, 2013, 5(10): 4113-4119.
[36] Ryu J, Kim H S, Hahn H T. Reactive sintering of copper nanoparticles using intense pulsed light for printed electro-nics[J]. Journal of Electronic Materials, 2011, 40(1): 42-50.
[37] Han W S, Hong J M, Kim H S, Song Y W. Multi-pulsed white light sintering of printed Cu nanoinks[J]. Nanotechnology, 2011, 22(39): 6.
[38] Hosel M, Krebs F C. Large-scale roll-to-roll photonic sintering of flexo printed silver nanoparticle electrodes[J]. Journal of Materials Chemistry, 2012, 22(31): 15683-15688.
[39] Helgesen M, Carle J E, Andreasen B, Hosel M, Norrman K, Sondergaard R, Krebs F C. Rapid flash annealing of thermally reactive copolymers in a roll-to-roll process for polymer solar cells[J]. Polymer Chemistry, 2012, 3(9): 2649-2655.