Study on Alkali-soluble Epoxy Acrylates Resin Modified by Glycidyl Ester of Versatic Acid

doi:10.7517/issn.1674-0475.190105

Abstract

Abstract: In this paper, the glycidyl ester of versatic acid (E10p) was used to modify the alkali-soluble epoxy acrylates resin,then the modified resin was applied to the solder resist ink to improve its resolution and resistance undercut. The results showed that the modified resin exhibits exceptional photosensitivity, good heat resistance and flexibility. Compared with unmodified resin, the solder resist ink prepared with the modified resin improved the resolution from 75 μm line spacing to 50 μm, and reduced the resistance undercut from 37.5 μm to 24.5 μm, showing higher resolution and better side erosion resistance.

Key words: epoxy acrylate, glycidyl ester of versatic acid, solder resist ink, resolution

WANG Haodong, SUN Guanqing, AN Fenglei, YUAN Yanhua, LIU Ren. Study on Alkali-soluble Epoxy Acrylates Resin Modified by Glycidyl Ester of Versatic Acid[J]. Imaging Science and Photochemistry, 2019, 37(3): 185-194.

References

[1] Wang P C, Liu Y M, Chang C P, Liao Y Y, Peng Y Y, Ger M D. A laser curable palladium complex ink used for fabrication of copper pattern on polyimide substrate[J]. Journal of the Taiwan Institute of Chemical Engineers, 2017, 80:963-969.
[2] Lee H, Kim C, Heo C, Kim C, Lee J H, Kim Y. Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn-Ag-Cu solder[J]. Microelectronics Reliability, 2018, 87:75-80.
[3] Huang C Y, Ying K C. Applying strain gauges to measuring thermal warpage of printed circuit boards[J]. Measurement, 2017, 110:239-248.
[4] 林盛鑫,林洪军,叶军,李引娣.印制电路板制造关键技术概述[J]. 通信电源技术, 2018, 35(2):182-183. Lin S X, Lin H J, Ye J, Li Y D. Research on the key technology of printed-circuit board[J]. Communication Power Technology, 2018, 35(2):182-183.
[5] 齐成. PCB用液态阻焊膜网印质量控制和故障排除[J]. 印制电路信息, 2011, (1):46-53. Qi C. Printed circuit board film of solder mask quantity control and breakdown exclusion in the silk scree printing[J]. Printed Circuit Information, 2011, (1):46-53.
[6] 宋振,杨志锋,兰朝辉.一款低侧蚀、高感度的液态感光阻焊油墨的设计与开发[J]. 印制电路信息,2018,26(9):38-41. Song Z, Yang Z F, Lan C H. Design and achievement of a low undercut high sensitivity photo-cuing solder mask[J]. Printed Circuit Information, 2018, 26(9):38-41.
[7] 李长春.挠性电路板用阻焊油墨中的柔性树脂合成及应用[J]. 印制电路信息, 2017, 25(5):34-38. Li C C. Synthesis and application of flexible resin in solder resist ink for FPCB[J]. Printed Circuit Information, 2017, 25(5):34-38.
[8] Liu Q, Orme M. High precision solder droplet printing technology and the state-of-the-art[J]. Journal of Materials Processing Technology, 2001, 115(3):271-283.
[9] 周亮.环氧丙烯酸酯光固化体系及积层电路板用感光成像油墨的研究[D]. 广州:华南理工大学, 2003. Zhou L. Study on photosensitive image ink for epoxy acrylate light curing system and laminated circuit board[D]. Guangzhou:South China University of Technology, 2003.
[10] 约翰·孔罗德. 不同频段下如何选择适用于5G功率放大器电路的线路板材[J].电子产品世界, 2018, 25(9):18-21, 47. Coonrod J. Selecting circuit material for the different spectra of 5G power amplifiers[J]. Electronic Products World, 2018, 25(9):18-21, 47.
[11] 高明,邓光万,任碧野,刘新星,童真,曾幸荣. 酚醛环氧丙烯酸光敏树脂的合成及应用[J]. 涂料工业, 2009, 39(5):35-38. Gao M, Deng G W, Ren B Y, Liu X X, Tong Z, Zeng X R. Synthesis and application of photosensitive novolac epoxy acrylate resins[J]. Coatings Industry, 2009, 39(5):35-38.
[12] 高冰. 新型碱溶性感光树脂的合成及性能研究[D]. 沈阳:沈阳工业大学, 2015. Gao B. Study on synthesis and properties of novel alkali soluble photosensitive resin[D]. Shenyang:Shenyang University of Technology, 2015.
[13] Boogh L,Pettersson B, Månson J A E. Dendritic hyperbranched polymers as tougheners for epoxy resins[J]. Journal of East China University of Science & Technology, 2006, 40(9):2249-2261.
[14] Ahmed M A, Kandil U F, Shaker N O, Hashem A I. The overall effect of reactive rubber nanoparticles and nano clay on the mechanical properties of epoxy resin[J].Journal of Radiation Research & Applied Sciences,2015,8(4):549-561.
[15] Lei F, Zhang C T, Cai Z P, Sun D Z. Epoxy toughening with graphite fluoride:toward high toughness and strength[J]. Polymer, 150(2018):44-45.
[16] 赵蕾,李林洪,李巧玲. 酚醛环氧树脂的改性研究进展[J]. 应用化工, 2016, 45(10):1950-1953. Zhao L, Li L H, Li Q L. Progress in modification of novolac epoxy resin[J]. Applied Chemical Industry, 2016, 45(10):1950-1953.
[17] 胡开创. UV固化酚醛环氧丙烯酸酯的合成与应用[D]. 南昌:南昌大学, 2014. Hu K C. The synthesis and apply of UV-curing phenolic epoxy acrylate[D]. Nanchang:Nanchang University, 2014.
[18] Steindl J, Koch T, Moszner N, Gorsche C. Silane-acrylate chemistry for regulating network formation in radical photopolymerization[J]. Macromolecules, 2017, 50(19):7448.
[19] 刘标,周岳珅,杨志磊,高延敏. 环氧丙烯酸树脂相结构对力学性能影响[J]. 安徽理工大学学报(自然科学版), 2017, 37(2):34-38. Liu B, Zhou Y S, Yang Z L, Gao Y M. A study of the influence of phase structure on mechanical properties based on epoxy acrylate resin[J]. Journal of Anhui University of Technology (Natural Science Edition), 2017, 37(2):34-38.
[20] 肖英,黄超明,李毅. C10叔碳酸缩水甘油酯的应用概况[J]. 广州化工, 2017, 45(21):13-16. Xiao Y, Huang C M, Li Y. Application of glycidyl neodecanoate[J]. Guangzhou Chemical Industry, 2017, 45(21):13-16.
[21] 孙兰波.叔碳酸乙烯酯和叔碳酸缩水甘油酯在水性工业涂料中的应用[J]. 现代涂料与涂装, 2017, 20(5):12-17, 52. Sun L B. Application of vinyl esters and glycidyl esters of tertiary carboxylic acids in waterborne industria coatings[J]. Modern Paint and Finishing, 2017, 20(5):12-17, 52.