Development of Matrix Resins for 248 nm Deep UV Photoresist

doi:10.7517/issn.1674-0475.191014

Abstract

Abstract: Different kinds of matrix resins and structures used in 248 nm chemically amplified deep UV photoresist were summarized,including poly(methyl methacrylate) and its derivatives, poly(p-hydroxystyrene) and its derivatives, N-substituted maleimide derivatives and other polymers, and the influences of the structure and exposure conditions of film-forming resins or monomers on photoresist properties were discussed.

Key words: photoresist, matrix resin, chemical amplification, exposure

WEI Zibo, MA Wenchao, QIU Yingxin. Development of Matrix Resins for 248 nm Deep UV Photoresist[J]. Imaging Science and Photochemistry, 2020, 38(3): 430-435.

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