影像科学与光化学 ›› 1998, Vol. 16 ›› Issue (3): 245-249.DOI: 10.7517/j.issn.1674-0475.1998.03.245

• 研究论文 • 上一篇    下一篇

高玻璃化温度化学增幅光致抗蚀剂的制备

王慧1, 游凤祥1, 陈明1, 李元昌1, 卢建平1, 洪啸吟1, 黄志齐2, 胡德甫2   

  1. 1. 清华大学化学系, 北京 100084;
    2. 北京化学试剂所, 北京 100022
  • 收稿日期:1997-12-08 修回日期:1998-02-12 出版日期:1998-08-20 发布日期:1998-08-20
  • 通讯作者: 洪啸吟
  • 基金资助:
    国家自然科学基金(批准号:59633110,59773007)

PREPARATION OF WATER BASED NEGATIVE CHEMICAL AMPLIFIED PHOTORESIST WITH HIGH GLASS TRANSITION TEMPERATURE

WANG Hui1, YOU Fengxiang1, CHEN Ming1, LI Yuanchang1, LU Jianping1, HONG Xiaoyin1, HUANG Zhiqi2, HU Defu2   

  1. 1. Department of Chemistry, Tsinghua University, Beijing 100084, P. R. China;
    2. The Institute of Chemical Reagent, Beijing 100022, P. R. China
  • Received:1997-12-08 Revised:1998-02-12 Online:1998-08-20 Published:1998-08-20

摘要: 本文合成了一种具有高玻璃化温度的苯乙烯和N-(4-羟基苯基)马来酰亚胺的共聚体,并将其应用于紫外负性水型化学增幅抗蚀剂中,并初步确定了该光致抗蚀剂的光刻工艺操作条件,得到了分辨率为1.39µm的光刻图形。

关键词: 光致抗蚀剂, 光刻, 苯乙烯和N-(4-羟基苯基)马来酰亚胺共聚体

Abstract: A water-based near-UV negative chemical amplified photoresist was developed,consisting of styrene-co-N-(4-hydroxyphenyl)maleimide with high glass transition temperature (Tg), hexamethoxymethylmelamine (HMMM) triphenyl sulfonium salt.The conditions of photolithograpy process were preliminarily defined.Based on our research,the pattern with 1.39 µm lines and spaces was obtained by the conventional UV photolithography under the optimum parameters.

Key words: photoresist, photolithography, polystyrene-co-N-(4-hydroxypheny1)maleimide